Using an embedded Buckypaper to monitor mode I crack growth in bonded joints.
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| Title: | Using an embedded Buckypaper to monitor mode I crack growth in bonded joints. |
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| Authors: | Gaztelumendi, Idoia1 (AUTHOR) idoia.gaztelumendi@tecnalia.com, Villaverde, H.1 (AUTHOR), Pérez, B.1 (AUTHOR), Chapartegui, M.1 (AUTHOR), Flórez, S.1 (AUTHOR), Manterola, J.2 (AUTHOR), Zurbitu, J.2 (AUTHOR) |
| Source: | Journal of Adhesion. 2022, Vol. 98 Issue 5, p488-506. 19p. |
| Database: | Academic Search Ultimate |
| ISSN: | 00218464 |
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| DOI: | 10.1080/00218464.2020.1842206 |
