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Rapid formation of high aspect ratio through holes in thin glass substrates using an engineered, QCW laser approach.

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Bibliographic Details
Title: Rapid formation of high aspect ratio through holes in thin glass substrates using an engineered, QCW laser approach.
Authors: Matsumoto, Hisashi1 (AUTHOR) Hisashi.Matsumoto@mksinst.com, Lin, Zhibin1 (AUTHOR), Schrauben, Joel N.1 (AUTHOR), Kleinert, Jan1 (AUTHOR), Vázquez, Rodrigo Gómez2 (AUTHOR), Buttazzoni, Michele2 (AUTHOR), Otto, Andreas2 (AUTHOR)
Source: Applied Physics A: Materials Science & Processing. Apr2022, Vol. 128 Issue 4, p1-10. 10p. 3 Color Photographs, 2 Black and White Photographs, 3 Diagrams, 1 Graph.
Database: Academic Search Ultimate
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Description
ISSN:09478396
DOI:10.1007/s00339-022-05404-4