THE EFFECT OF POWER ULTRASOUND ON MICROSTRUCTURE EVOLUTION DURING THE TRANSIENT LIQUID STAGE OF ULTRASONIC-PROMOTED TLP BONDING SiCp/Al MMCs.

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Bibliographic Details
Title:	THE EFFECT OF POWER ULTRASOUND ON MICROSTRUCTURE EVOLUTION DURING THE TRANSIENT LIQUID STAGE OF ULTRASONIC-PROMOTED TLP BONDING SiCp/Al MMCs.
Authors:	CHANGZHUANG ZHOU¹, LIN MA^1,2 linma@sau.edu.cn, CHAO ZHU¹, QINGHE CUI¹, JINDI LIANG¹, YUJIAN SONG¹
Source:	Archives of Metallurgy & Materials. 2022, Vol. 67 Issue 4, p1283-1291. 9p.
Database:	Academic Search Ultimate

Description
ISSN:	17333490
DOI:	10.24425/amm.2022.141053