APA (7th ed.) Citation

ZHOU, C., MA, L., ZHU, C., CUI, Q., LIANG, J., & SONG, Y. (2022). THE EFFECT OF POWER ULTRASOUND ON MICROSTRUCTURE EVOLUTION DURING THE TRANSIENT LIQUID STAGE OF ULTRASONIC-PROMOTED TLP BONDING SiCp/Al MMCs. Archives of Metallurgy & Materials, 67(4), 1283. https://doi.org/10.24425/amm.2022.141053

Chicago Style (17th ed.) Citation

ZHOU, CHANGZHUANG, LIN MA, CHAO ZHU, QINGHE CUI, JINDI LIANG, and YUJIAN SONG. "THE EFFECT OF POWER ULTRASOUND ON MICROSTRUCTURE EVOLUTION DURING THE TRANSIENT LIQUID STAGE OF ULTRASONIC-PROMOTED TLP BONDING SiCp/Al MMCs." Archives of Metallurgy & Materials 67, no. 4 (2022): 1283. https://doi.org/10.24425/amm.2022.141053.

MLA (9th ed.) Citation

ZHOU, CHANGZHUANG, et al. "THE EFFECT OF POWER ULTRASOUND ON MICROSTRUCTURE EVOLUTION DURING THE TRANSIENT LIQUID STAGE OF ULTRASONIC-PROMOTED TLP BONDING SiCp/Al MMCs." Archives of Metallurgy & Materials, vol. 67, no. 4, 2022, p. 1283, https://doi.org/10.24425/amm.2022.141053.