View in EDS PDF Full Text

THE EFFECT OF POWER ULTRASOUND ON MICROSTRUCTURE EVOLUTION DURING THE TRANSIENT LIQUID STAGE OF ULTRASONIC-PROMOTED TLP BONDING SiCp/Al MMCs.

Saved in:
Bibliographic Details
Title: THE EFFECT OF POWER ULTRASOUND ON MICROSTRUCTURE EVOLUTION DURING THE TRANSIENT LIQUID STAGE OF ULTRASONIC-PROMOTED TLP BONDING SiCp/Al MMCs.
Authors: CHANGZHUANG ZHOU1, LIN MA1,2 linma@sau.edu.cn, CHAO ZHU1, QINGHE CUI1, JINDI LIANG1, YUJIAN SONG1
Source: Archives of Metallurgy & Materials. 2022, Vol. 67 Issue 4, p1283-1291. 9p.
Database: Academic Search Ultimate
FullText Links:
  – Type: pdflink
Text:
  Availability: 0
Header DbId: asn
DbLabel: Academic Search Ultimate
An: 158378804
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: THE EFFECT OF POWER ULTRASOUND ON MICROSTRUCTURE EVOLUTION DURING THE TRANSIENT LIQUID STAGE OF ULTRASONIC-PROMOTED TLP BONDING SiCp/Al MMCs.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22CHANGZHUANG+ZHOU%22">CHANGZHUANG ZHOU</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22LIN+MA%22">LIN MA</searchLink><relatesTo>1,2</relatesTo><i> linma@sau.edu.cn</i><br /><searchLink fieldCode="AR" term="%22CHAO+ZHU%22">CHAO ZHU</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22QINGHE+CUI%22">QINGHE CUI</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22JINDI+LIANG%22">JINDI LIANG</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22YUJIAN+SONG%22">YUJIAN SONG</searchLink><relatesTo>1</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Archives+of+Metallurgy+%26+Materials%22">Archives of Metallurgy & Materials</searchLink>. 2022, Vol. 67 Issue 4, p1283-1291. 9p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=158378804
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.24425/amm.2022.141053
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 9
        StartPage: 1283
    Titles:
      – TitleFull: THE EFFECT OF POWER ULTRASOUND ON MICROSTRUCTURE EVOLUTION DURING THE TRANSIENT LIQUID STAGE OF ULTRASONIC-PROMOTED TLP BONDING SiCp/Al MMCs.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: CHANGZHUANG ZHOU
      – PersonEntity:
          Name:
            NameFull: LIN MA
      – PersonEntity:
          Name:
            NameFull: CHAO ZHU
      – PersonEntity:
          Name:
            NameFull: QINGHE CUI
      – PersonEntity:
          Name:
            NameFull: JINDI LIANG
      – PersonEntity:
          Name:
            NameFull: YUJIAN SONG
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 10
              Text: 2022
              Type: published
              Y: 2022
          Identifiers:
            – Type: issn-print
              Value: 17333490
          Numbering:
            – Type: volume
              Value: 67
            – Type: issue
              Value: 4
          Titles:
            – TitleFull: Archives of Metallurgy & Materials
              Type: main
ResultId 1