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Warpage and residual stress analyses of post-mold cure process of IC packages.

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Bibliographic Details
Title: Warpage and residual stress analyses of post-mold cure process of IC packages.
Authors: Lin, Ming-Yu1 (AUTHOR), Zeng, Yong-Jie1 (AUTHOR), Hwang, Sheng-Jye1 (AUTHOR) jimppl@mail.ncku.edu.tw, Wang, Ming-Han2 (AUTHOR), Liu, Hui-Ping2 (AUTHOR), Fang, Chin-Lung2 (AUTHOR)
Source: International Journal of Advanced Manufacturing Technology. 1/8/2023, Vol. 124 Issue 3/4, p1017-1039. 23p. 1 Color Photograph, 10 Diagrams, 10 Charts, 21 Graphs.
Database: Academic Search Ultimate
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Description
ISSN:02683768
DOI:10.1007/s00170-022-10436-4