APA (7th ed.) Citation

Lin, M., Zeng, Y., Hwang, S., Wang, M., Liu, H., & Fang, C. (2023). Warpage and residual stress analyses of post-mold cure process of IC packages. International Journal of Advanced Manufacturing Technology, 124(3/4), 1017. https://doi.org/10.1007/s00170-022-10436-4

Chicago Style (17th ed.) Citation

Lin, Ming-Yu, Yong-Jie Zeng, Sheng-Jye Hwang, Ming-Han Wang, Hui-Ping Liu, and Chin-Lung Fang. "Warpage and Residual Stress Analyses of Post-mold Cure Process of IC Packages." International Journal of Advanced Manufacturing Technology 124, no. 3/4 (2023): 1017. https://doi.org/10.1007/s00170-022-10436-4.

MLA (9th ed.) Citation

Lin, Ming-Yu, et al. "Warpage and Residual Stress Analyses of Post-mold Cure Process of IC Packages." International Journal of Advanced Manufacturing Technology, vol. 124, no. 3/4, 2023, p. 1017, https://doi.org/10.1007/s00170-022-10436-4.