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Warpage and residual stress analyses of post-mold cure process of IC packages.

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Title: Warpage and residual stress analyses of post-mold cure process of IC packages.
Authors: Lin, Ming-Yu1 (AUTHOR), Zeng, Yong-Jie1 (AUTHOR), Hwang, Sheng-Jye1 (AUTHOR) jimppl@mail.ncku.edu.tw, Wang, Ming-Han2 (AUTHOR), Liu, Hui-Ping2 (AUTHOR), Fang, Chin-Lung2 (AUTHOR)
Source: International Journal of Advanced Manufacturing Technology. 1/8/2023, Vol. 124 Issue 3/4, p1017-1039. 23p. 1 Color Photograph, 10 Diagrams, 10 Charts, 21 Graphs.
Database: Academic Search Ultimate
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An: 161191528
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  Data: Warpage and residual stress analyses of post-mold cure process of IC packages.
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  Data: <searchLink fieldCode="JN" term="%22International+Journal+of+Advanced+Manufacturing+Technology%22">International Journal of Advanced Manufacturing Technology</searchLink>. 1/8/2023, Vol. 124 Issue 3/4, p1017-1039. 23p. 1 Color Photograph, 10 Diagrams, 10 Charts, 21 Graphs.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=161191528
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s00170-022-10436-4
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      – Code: eng
        Text: English
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        PageCount: 23
        StartPage: 1017
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      – TitleFull: Warpage and residual stress analyses of post-mold cure process of IC packages.
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            NameFull: Lin, Ming-Yu
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            NameFull: Zeng, Yong-Jie
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            NameFull: Hwang, Sheng-Jye
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            NameFull: Wang, Ming-Han
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            NameFull: Liu, Hui-Ping
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            NameFull: Fang, Chin-Lung
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            – D: 08
              M: 01
              Text: 1/8/2023
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              Y: 2023
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              Value: 124
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            – TitleFull: International Journal of Advanced Manufacturing Technology
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