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Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review.

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Title: Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review.
Authors: Jang, Ye Jin1 (AUTHOR) yjjang@uos.ac.kr, Sharma, Ashutosh2 (AUTHOR) stannum.ashu@gmail.com, Jung, Jae Pil1 (AUTHOR) stannum.ashu@gmail.com
Source: Materials (1996-1944). Dec2023, Vol. 16 Issue 24, p7652. 40p.
Database: Academic Search Ultimate
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ISSN:19961944
DOI:10.3390/ma16247652