APA (7th ed.) Citation

Jang, Y. J., Sharma, A., & Jung, J. P. (2023). Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review. Materials (1996-1944), 16(24), 7652. https://doi.org/10.3390/ma16247652

Chicago Style (17th ed.) Citation

Jang, Ye Jin, Ashutosh Sharma, and Jae Pil Jung. "Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review." Materials (1996-1944) 16, no. 24 (2023): 7652. https://doi.org/10.3390/ma16247652.

MLA (9th ed.) Citation

Jang, Ye Jin, et al. "Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review." Materials (1996-1944), vol. 16, no. 24, 2023, p. 7652, https://doi.org/10.3390/ma16247652.