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Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review.

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Title: Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review.
Authors: Jang, Ye Jin1 (AUTHOR) yjjang@uos.ac.kr, Sharma, Ashutosh2 (AUTHOR) stannum.ashu@gmail.com, Jung, Jae Pil1 (AUTHOR) stannum.ashu@gmail.com
Source: Materials (1996-1944). Dec2023, Vol. 16 Issue 24, p7652. 40p.
Database: Academic Search Ultimate
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Header DbId: asn
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An: 174464026
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  Data: Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review.
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  Data: <searchLink fieldCode="AR" term="%22Jang%2C+Ye+Jin%22">Jang, Ye Jin</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> yjjang@uos.ac.kr</i><br /><searchLink fieldCode="AR" term="%22Sharma%2C+Ashutosh%22">Sharma, Ashutosh</searchLink><relatesTo>2</relatesTo> (AUTHOR)<i> stannum.ashu@gmail.com</i><br /><searchLink fieldCode="AR" term="%22Jung%2C+Jae+Pil%22">Jung, Jae Pil</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> stannum.ashu@gmail.com</i>
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  Data: <searchLink fieldCode="JN" term="%22Materials+%281996-1944%29%22">Materials (1996-1944)</searchLink>. Dec2023, Vol. 16 Issue 24, p7652. 40p.
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        Value: 10.3390/ma16247652
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      – Code: eng
        Text: English
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        StartPage: 7652
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      – TitleFull: Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review.
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            NameFull: Jang, Ye Jin
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            NameFull: Sharma, Ashutosh
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              Text: Dec2023
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              Y: 2023
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              Value: 16
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