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Prediction of Subsurface Microcrack Damage Depth Based on Surface Roughness in Diamond Wire Sawing of Monocrystalline Silicon.

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Title: Prediction of Subsurface Microcrack Damage Depth Based on Surface Roughness in Diamond Wire Sawing of Monocrystalline Silicon.
Authors: Wang, Keying1 (AUTHOR), Gao, Yufei1,2 (AUTHOR) yfgao@sdu.edu.cn, Yang, Chunfeng1 (AUTHOR)
Source: Materials (1996-1944). Feb2024, Vol. 17 Issue 3, p553. 13p.
Database: Academic Search Ultimate
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ISSN:19961944
DOI:10.3390/ma17030553