APA (7th ed.) Citation

Wang, K., Gao, Y., & Yang, C. (2024). Prediction of Subsurface Microcrack Damage Depth Based on Surface Roughness in Diamond Wire Sawing of Monocrystalline Silicon. Materials (1996-1944), 17(3), 553. https://doi.org/10.3390/ma17030553

Chicago Style (17th ed.) Citation

Wang, Keying, Yufei Gao, and Chunfeng Yang. "Prediction of Subsurface Microcrack Damage Depth Based on Surface Roughness in Diamond Wire Sawing of Monocrystalline Silicon." Materials (1996-1944) 17, no. 3 (2024): 553. https://doi.org/10.3390/ma17030553.

MLA (9th ed.) Citation

Wang, Keying, et al. "Prediction of Subsurface Microcrack Damage Depth Based on Surface Roughness in Diamond Wire Sawing of Monocrystalline Silicon." Materials (1996-1944), vol. 17, no. 3, 2024, p. 553, https://doi.org/10.3390/ma17030553.