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Enhancing the bond strength of magnetron-sputtered copper layers on polyimide and polyether ether ketone surfaces through surface modification.

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Bibliographic Details
Title: Enhancing the bond strength of magnetron-sputtered copper layers on polyimide and polyether ether ketone surfaces through surface modification.
Authors: Wang, Ruijun1 (AUTHOR), Liu, Puren1 (AUTHOR), Liu, Jingbo2 (AUTHOR), Wang, Tianshi2 (AUTHOR), Pang, Xiaolu1 (AUTHOR), Xu, Lining1 (AUTHOR) xulining@ustb.edu.cn, Qiao, Lijie1 (AUTHOR)
Source: Journal of Adhesion Science & Technology. Jul2024, Vol. 38 Issue 13, p2388-2404. 17p.
Database: Academic Search Ultimate
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ISSN:01694243
DOI:10.1080/01694243.2024.2302250