APA (7th ed.) Citation

Wang, R., Liu, P., Liu, J., Wang, T., Pang, X., Xu, L., & Qiao, L. (2024). Enhancing the bond strength of magnetron-sputtered copper layers on polyimide and polyether ether ketone surfaces through surface modification. Journal of Adhesion Science & Technology, 38(13), 2388. https://doi.org/10.1080/01694243.2024.2302250

Chicago Style (17th ed.) Citation

Wang, Ruijun, Puren Liu, Jingbo Liu, Tianshi Wang, Xiaolu Pang, Lining Xu, and Lijie Qiao. "Enhancing the Bond Strength of Magnetron-sputtered Copper Layers on Polyimide and Polyether Ether Ketone Surfaces Through Surface Modification." Journal of Adhesion Science & Technology 38, no. 13 (2024): 2388. https://doi.org/10.1080/01694243.2024.2302250.

MLA (9th ed.) Citation

Wang, Ruijun, et al. "Enhancing the Bond Strength of Magnetron-sputtered Copper Layers on Polyimide and Polyether Ether Ketone Surfaces Through Surface Modification." Journal of Adhesion Science & Technology, vol. 38, no. 13, 2024, p. 2388, https://doi.org/10.1080/01694243.2024.2302250.