View in EDS HTML Full Text PDF Full Text

Enhancing the bond strength of magnetron-sputtered copper layers on polyimide and polyether ether ketone surfaces through surface modification.

Saved in:
Bibliographic Details
Title: Enhancing the bond strength of magnetron-sputtered copper layers on polyimide and polyether ether ketone surfaces through surface modification.
Authors: Wang, Ruijun1 (AUTHOR), Liu, Puren1 (AUTHOR), Liu, Jingbo2 (AUTHOR), Wang, Tianshi2 (AUTHOR), Pang, Xiaolu1 (AUTHOR), Xu, Lining1 (AUTHOR) xulining@ustb.edu.cn, Qiao, Lijie1 (AUTHOR)
Source: Journal of Adhesion Science & Technology. Jul2024, Vol. 38 Issue 13, p2388-2404. 17p.
Database: Academic Search Ultimate
Full text is not displayed to guests.
FullText Links:
  – Type: pdflink
Text:
  Availability: 1
Header DbId: asn
DbLabel: Academic Search Ultimate
An: 178176958
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Enhancing the bond strength of magnetron-sputtered copper layers on polyimide and polyether ether ketone surfaces through surface modification.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Wang%2C+Ruijun%22">Wang, Ruijun</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Liu%2C+Puren%22">Liu, Puren</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Liu%2C+Jingbo%22">Liu, Jingbo</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Wang%2C+Tianshi%22">Wang, Tianshi</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Pang%2C+Xiaolu%22">Pang, Xiaolu</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Xu%2C+Lining%22">Xu, Lining</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> xulining@ustb.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Qiao%2C+Lijie%22">Qiao, Lijie</searchLink><relatesTo>1</relatesTo> (AUTHOR)
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Adhesion+Science+%26+Technology%22">Journal of Adhesion Science & Technology</searchLink>. Jul2024, Vol. 38 Issue 13, p2388-2404. 17p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=178176958
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1080/01694243.2024.2302250
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 17
        StartPage: 2388
    Titles:
      – TitleFull: Enhancing the bond strength of magnetron-sputtered copper layers on polyimide and polyether ether ketone surfaces through surface modification.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Wang, Ruijun
      – PersonEntity:
          Name:
            NameFull: Liu, Puren
      – PersonEntity:
          Name:
            NameFull: Liu, Jingbo
      – PersonEntity:
          Name:
            NameFull: Wang, Tianshi
      – PersonEntity:
          Name:
            NameFull: Pang, Xiaolu
      – PersonEntity:
          Name:
            NameFull: Xu, Lining
      – PersonEntity:
          Name:
            NameFull: Qiao, Lijie
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 07
              Text: Jul2024
              Type: published
              Y: 2024
          Identifiers:
            – Type: issn-print
              Value: 01694243
          Numbering:
            – Type: volume
              Value: 38
            – Type: issue
              Value: 13
          Titles:
            – TitleFull: Journal of Adhesion Science & Technology
              Type: main
ResultId 1