View in EDS HTML Full Text PDF Full Text

Joining of silicon nitride ceramic to oxygen‐free copper using Ag–Cu–TiH2 filler.

Saved in:
Bibliographic Details
Title: Joining of silicon nitride ceramic to oxygen‐free copper using Ag–Cu–TiH2 filler.
Authors: Tang, Liangliang1,2 (AUTHOR), Yao, Dongxu1 (AUTHOR), Xia, Yongfeng1 (AUTHOR), Zhao, Jun1 (AUTHOR), Zhu, Ming1 (AUTHOR), Zeng, Yu‐Ping1 (AUTHOR) yuping-zeng@mail.sic.ac.cn
Source: Journal of the American Ceramic Society. Sep2024, Vol. 107 Issue 9, p6439-6455. 17p.
Database: Academic Search Ultimate
Full text is not displayed to guests.
Description
ISSN:00027820
DOI:10.1111/jace.19921