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Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding.

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Title: Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding.
Authors: Han, Seonghui1,2 (AUTHOR) han6755@kitech.re.kr, Han, Sang-Eun1,3 (AUTHOR) sangeun35@kitech.re.kr, Lee, Tae-Young4 (AUTHOR) lty1226@tukorea.ac.kr, Han, Deok-Gon5 (AUTHOR) deokgon.han@gmail.com, Park, Young-Bae2 (AUTHOR) ybpark@anu.ac.kr, Yoo, Sehoon1 (AUTHOR) ybpark@anu.ac.kr
Source: Materials (1996-1944). Jul2024, Vol. 17 Issue 14, p3619. 11p.
Database: Academic Search Ultimate
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ISSN:19961944
DOI:10.3390/ma17143619