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Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding.

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Title: Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding.
Authors: Han, Seonghui1,2 (AUTHOR) han6755@kitech.re.kr, Han, Sang-Eun1,3 (AUTHOR) sangeun35@kitech.re.kr, Lee, Tae-Young4 (AUTHOR) lty1226@tukorea.ac.kr, Han, Deok-Gon5 (AUTHOR) deokgon.han@gmail.com, Park, Young-Bae2 (AUTHOR) ybpark@anu.ac.kr, Yoo, Sehoon1 (AUTHOR) ybpark@anu.ac.kr
Source: Materials (1996-1944). Jul2024, Vol. 17 Issue 14, p3619. 11p.
Database: Academic Search Ultimate
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An: 178697123
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  Data: Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding.
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  Data: <searchLink fieldCode="AR" term="%22Han%2C+Seonghui%22">Han, Seonghui</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<i> han6755@kitech.re.kr</i><br /><searchLink fieldCode="AR" term="%22Han%2C+Sang-Eun%22">Han, Sang-Eun</searchLink><relatesTo>1,3</relatesTo> (AUTHOR)<i> sangeun35@kitech.re.kr</i><br /><searchLink fieldCode="AR" term="%22Lee%2C+Tae-Young%22">Lee, Tae-Young</searchLink><relatesTo>4</relatesTo> (AUTHOR)<i> lty1226@tukorea.ac.kr</i><br /><searchLink fieldCode="AR" term="%22Han%2C+Deok-Gon%22">Han, Deok-Gon</searchLink><relatesTo>5</relatesTo> (AUTHOR)<i> deokgon.han@gmail.com</i><br /><searchLink fieldCode="AR" term="%22Park%2C+Young-Bae%22">Park, Young-Bae</searchLink><relatesTo>2</relatesTo> (AUTHOR)<i> ybpark@anu.ac.kr</i><br /><searchLink fieldCode="AR" term="%22Yoo%2C+Sehoon%22">Yoo, Sehoon</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> ybpark@anu.ac.kr</i>
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  Data: <searchLink fieldCode="JN" term="%22Materials+%281996-1944%29%22">Materials (1996-1944)</searchLink>. Jul2024, Vol. 17 Issue 14, p3619. 11p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=178697123
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        Value: 10.3390/ma17143619
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 11
        StartPage: 3619
    Titles:
      – TitleFull: Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding.
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            NameFull: Han, Seonghui
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            NameFull: Han, Sang-Eun
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            NameFull: Han, Deok-Gon
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            NameFull: Park, Young-Bae
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            NameFull: Yoo, Sehoon
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            – D: 15
              M: 07
              Text: Jul2024
              Type: published
              Y: 2024
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              Value: 17
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              Value: 14
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