View in EDS HTML Full Text PDF Full Text

Laser ablation and stealth dicing of full-thickness silicon wafer.

Saved in:
Bibliographic Details
Title: Laser ablation and stealth dicing of full-thickness silicon wafer.
Authors: Son, Yeongil1 (AUTHOR), Shin, Joonghan1,2,3 (AUTHOR) jhshin@kongju.ac.kr
Source: International Journal of Advanced Manufacturing Technology. Mar2025, Vol. 137 Issue 3, p1599-1614. 16p.
Database: Academic Search Ultimate
Full text is not displayed to guests.
Description
ISSN:02683768
DOI:10.1007/s00170-025-15275-7