APA (7th ed.) Citation

Son, Y., & Shin, J. (2025). Laser ablation and stealth dicing of full-thickness silicon wafer. International Journal of Advanced Manufacturing Technology, 137(3), 1599. https://doi.org/10.1007/s00170-025-15275-7

Chicago Style (17th ed.) Citation

Son, Yeongil, and Joonghan Shin. "Laser Ablation and Stealth Dicing of Full-thickness Silicon Wafer." International Journal of Advanced Manufacturing Technology 137, no. 3 (2025): 1599. https://doi.org/10.1007/s00170-025-15275-7.

MLA (9th ed.) Citation

Son, Yeongil, and Joonghan Shin. "Laser Ablation and Stealth Dicing of Full-thickness Silicon Wafer." International Journal of Advanced Manufacturing Technology, vol. 137, no. 3, 2025, p. 1599, https://doi.org/10.1007/s00170-025-15275-7.