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Laser ablation and stealth dicing of full-thickness silicon wafer.

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Title: Laser ablation and stealth dicing of full-thickness silicon wafer.
Authors: Son, Yeongil1 (AUTHOR), Shin, Joonghan1,2,3 (AUTHOR) jhshin@kongju.ac.kr
Source: International Journal of Advanced Manufacturing Technology. Mar2025, Vol. 137 Issue 3, p1599-1614. 16p.
Database: Academic Search Ultimate
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  Data: Laser ablation and stealth dicing of full-thickness silicon wafer.
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  Data: <searchLink fieldCode="AR" term="%22Son%2C+Yeongil%22">Son, Yeongil</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Shin%2C+Joonghan%22">Shin, Joonghan</searchLink><relatesTo>1,2,3</relatesTo> (AUTHOR)<i> jhshin@kongju.ac.kr</i>
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  Data: <searchLink fieldCode="JN" term="%22International+Journal+of+Advanced+Manufacturing+Technology%22">International Journal of Advanced Manufacturing Technology</searchLink>. Mar2025, Vol. 137 Issue 3, p1599-1614. 16p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=183407441
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        Value: 10.1007/s00170-025-15275-7
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        Text: English
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        PageCount: 16
        StartPage: 1599
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      – TitleFull: Laser ablation and stealth dicing of full-thickness silicon wafer.
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              Text: Mar2025
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              Y: 2025
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