电子封装用功能梯度铝基复合材料研究应用进展.
Saved in:
| Title: | 电子封装用功能梯度铝基复合材料研究应用进展. |
|---|---|
| Alternate Title: | Progress in the Research and Application of Functionally Graded Aluminum Matrix Composites for Electronic Packaging. |
| Authors: | 方, 杰1,2 (AUTHOR), 刘, 彦强3 (AUTHOR), 杨, 志宇3 (AUTHOR), 樊, 建中1 (AUTHOR), 刁, 恩泽1 (AUTHOR), 崔, 西会2 (AUTHOR), 黎, 康杰2 (AUTHOR), 彭, 颐豫2 (AUTHOR), 张, 坤2 (AUTHOR), 孔, 欣2 (AUTHOR), 杨, 博2 (AUTHOR) |
| Source: | Nonferrous Metals. Aug2025, Vol. 15 Issue 8, p1295-1305. 11p. |
| Database: | Academic Search Ultimate |
|
Full text is not displayed to guests.
Login for full access.
|
|
| ISSN: | 20975384 |
|---|---|
| DOI: | 10.20242/j.issn.2097-5384.2025.08.005 |
