方, 杰., 刘, 彦., 杨, 志., 樊, 建., 刁, 恩., 崔, 西., . . . 杨, 博. (2025). 电子封装用功能梯度铝基复合材料研究应用进展. Nonferrous Metals, 15(8), 1295. https://doi.org/10.20242/j.issn.2097-5384.2025.08.005
Chicago Style (17th ed.) Citation方, 杰, et al. "电子封装用功能梯度铝基复合材料研究应用进展." Nonferrous Metals 15, no. 8 (2025): 1295. https://doi.org/10.20242/j.issn.2097-5384.2025.08.005.
MLA (9th ed.) Citation方, 杰, et al. "电子封装用功能梯度铝基复合材料研究应用进展." Nonferrous Metals, vol. 15, no. 8, 2025, p. 1295, https://doi.org/10.20242/j.issn.2097-5384.2025.08.005.
Warning: These citations may not always be 100% accurate.
