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电子封装用功能梯度铝基复合材料研究应用进展.

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Title: 电子封装用功能梯度铝基复合材料研究应用进展.
Alternate Title: Progress in the Research and Application of Functionally Graded Aluminum Matrix Composites for Electronic Packaging.
Authors: 方, 杰1,2 (AUTHOR), 刘, 彦强3 (AUTHOR), 杨, 志宇3 (AUTHOR), 樊, 建中1 (AUTHOR), 刁, 恩泽1 (AUTHOR), 崔, 西会2 (AUTHOR), 黎, 康杰2 (AUTHOR), 彭, 颐豫2 (AUTHOR), 张, 坤2 (AUTHOR), 孔, 欣2 (AUTHOR), 杨, 博2 (AUTHOR)
Source: Nonferrous Metals. Aug2025, Vol. 15 Issue 8, p1295-1305. 11p.
Database: Academic Search Ultimate
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        Value: 10.20242/j.issn.2097-5384.2025.08.005
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      – TitleFull: 电子封装用功能梯度铝基复合材料研究应用进展.
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              Text: Aug2025
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