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Role of active element Al in the interfacial bonding of sapphire by ultrasonic‐assisted soldering using Sn‐based alloys.

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Bibliographic Details
Title:	Role of active element Al in the interfacial bonding of sapphire by ultrasonic‐assisted soldering using Sn‐based alloys.
Authors:	Ma, Xinran¹ (AUTHOR), Xia, Yuanhang^1,2 (AUTHOR), Song, Mingda¹ (AUTHOR), Chen, Wei¹ (AUTHOR), Yan, Jiuchun¹ (AUTHOR) jcyan@hit.edu.cn
Source:	International Journal of Applied Ceramic Technology. Nov/Dec2025, Vol. 22 Issue 6, p1-13. 13p.
Database:	Academic Search Ultimate
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Description
ISSN:	1546542X
DOI:	10.1111/ijac.70015