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Enhancing Thermal Conductivity in Electrospun Polymer Structures for Heat Management Applications.

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Bibliographic Details
Title: Enhancing Thermal Conductivity in Electrospun Polymer Structures for Heat Management Applications.
Authors: Moradi, Ahmadreza1 (AUTHOR), Stachewicz, Urszula1 (AUTHOR) ustachew@agh.edu.pl
Source: Small Structures. Oct2025, Vol. 6 Issue 10, p1-38. 38p.
Database: Academic Search Ultimate
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Description
ISSN:26884062
DOI:10.1002/sstr.202500102