CTE match of copper foil and build-up film/core board in FCBGA substrate reduces warpage.
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| Title: | CTE match of copper foil and build-up film/core board in FCBGA substrate reduces warpage. |
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| Authors: | Wong, Winston1 (AUTHOR), Chiang, S. T.2,3 (AUTHOR), Huang, Jason C. S.2 (AUTHOR) u221430@gracethw.com, Zhou, X. D.3 (AUTHOR) |
| Source: | Scientific Reports. 11/21/2025, Vol. 15 Issue 1, p1-13. 13p. |
| Database: | Academic Search Ultimate |
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| ISSN: | 20452322 |
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| DOI: | 10.1038/s41598-025-25232-9 |
