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CTE match of copper foil and build-up film/core board in FCBGA substrate reduces warpage.

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Title: CTE match of copper foil and build-up film/core board in FCBGA substrate reduces warpage.
Authors: Wong, Winston1 (AUTHOR), Chiang, S. T.2,3 (AUTHOR), Huang, Jason C. S.2 (AUTHOR) u221430@gracethw.com, Zhou, X. D.3 (AUTHOR)
Source: Scientific Reports. 11/21/2025, Vol. 15 Issue 1, p1-13. 13p.
Database: Academic Search Ultimate
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  Data: CTE match of copper foil and build-up film/core board in FCBGA substrate reduces warpage.
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  Data: <searchLink fieldCode="AR" term="%22Wong%2C+Winston%22">Wong, Winston</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Chiang%2C+S%2E+T%2E%22">Chiang, S. T.</searchLink><relatesTo>2,3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Huang%2C+Jason+C%2E+S%2E%22">Huang, Jason C. S.</searchLink><relatesTo>2</relatesTo> (AUTHOR)<i> u221430@gracethw.com</i><br /><searchLink fieldCode="AR" term="%22Zhou%2C+X%2E+D%2E%22">Zhou, X. D.</searchLink><relatesTo>3</relatesTo> (AUTHOR)
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  Data: <searchLink fieldCode="JN" term="%22Scientific+Reports%22">Scientific Reports</searchLink>. 11/21/2025, Vol. 15 Issue 1, p1-13. 13p.
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        Value: 10.1038/s41598-025-25232-9
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        Text: English
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              Text: 11/21/2025
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