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Manufacturing and Application of Low-Cost Potting Adhesive with High Thermal Conductivity.

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Title: Manufacturing and Application of Low-Cost Potting Adhesive with High Thermal Conductivity.
Authors: Wang, Junxiang1 (AUTHOR), Zhang, Shiwei1,2 (AUTHOR), Yan, Caiman1 (AUTHOR), Li, Hongming1,2 (AUTHOR), Yin, Shubin1 (AUTHOR) yinshubinlive@gmail.com, Tang, Yong2 (AUTHOR)
Source: Materials (1996-1944). Nov2025, Vol. 18 Issue 21, p5011. 16p.
Database: Academic Search Ultimate
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ISSN:19961944
DOI:10.3390/ma18215011