APA (7th ed.) Citation

Wang, J., Zhang, S., Yan, C., Li, H., Yin, S., & Tang, Y. (2025). Manufacturing and Application of Low-Cost Potting Adhesive with High Thermal Conductivity. Materials (1996-1944), 18(21), 5011. https://doi.org/10.3390/ma18215011

Chicago Style (17th ed.) Citation

Wang, Junxiang, Shiwei Zhang, Caiman Yan, Hongming Li, Shubin Yin, and Yong Tang. "Manufacturing and Application of Low-Cost Potting Adhesive with High Thermal Conductivity." Materials (1996-1944) 18, no. 21 (2025): 5011. https://doi.org/10.3390/ma18215011.

MLA (9th ed.) Citation

Wang, Junxiang, et al. "Manufacturing and Application of Low-Cost Potting Adhesive with High Thermal Conductivity." Materials (1996-1944), vol. 18, no. 21, 2025, p. 5011, https://doi.org/10.3390/ma18215011.