Manufacturing and Application of Low-Cost Potting Adhesive with High Thermal Conductivity.

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Title: Manufacturing and Application of Low-Cost Potting Adhesive with High Thermal Conductivity.
Authors: Wang, Junxiang1 (AUTHOR), Zhang, Shiwei1,2 (AUTHOR), Yan, Caiman1 (AUTHOR), Li, Hongming1,2 (AUTHOR), Yin, Shubin1 (AUTHOR) yinshubinlive@gmail.com, Tang, Yong2 (AUTHOR)
Source: Materials (1996-1944). Nov2025, Vol. 18 Issue 21, p5011. 16p.
Database: Academic Search Ultimate
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An: 189611317
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  Data: Manufacturing and Application of Low-Cost Potting Adhesive with High Thermal Conductivity.
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  Data: <searchLink fieldCode="AR" term="%22Wang%2C+Junxiang%22">Wang, Junxiang</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zhang%2C+Shiwei%22">Zhang, Shiwei</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Yan%2C+Caiman%22">Yan, Caiman</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Li%2C+Hongming%22">Li, Hongming</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Yin%2C+Shubin%22">Yin, Shubin</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> yinshubinlive@gmail.com</i><br /><searchLink fieldCode="AR" term="%22Tang%2C+Yong%22">Tang, Yong</searchLink><relatesTo>2</relatesTo> (AUTHOR)
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  Data: <searchLink fieldCode="JN" term="%22Materials+%281996-1944%29%22">Materials (1996-1944)</searchLink>. Nov2025, Vol. 18 Issue 21, p5011. 16p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=189611317
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.3390/ma18215011
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      – Code: eng
        Text: English
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        PageCount: 16
        StartPage: 5011
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      – TitleFull: Manufacturing and Application of Low-Cost Potting Adhesive with High Thermal Conductivity.
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            NameFull: Wang, Junxiang
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            NameFull: Zhang, Shiwei
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            NameFull: Yan, Caiman
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            NameFull: Li, Hongming
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            NameFull: Yin, Shubin
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            – D: 01
              M: 11
              Text: Nov2025
              Type: published
              Y: 2025
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              Value: 19961944
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              Value: 18
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              Value: 21
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