Manufacturing and Application of Low-Cost Potting Adhesive with High Thermal Conductivity.
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| Title: | Manufacturing and Application of Low-Cost Potting Adhesive with High Thermal Conductivity. |
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| Authors: | Wang, Junxiang1 (AUTHOR), Zhang, Shiwei1,2 (AUTHOR), Yan, Caiman1 (AUTHOR), Li, Hongming1,2 (AUTHOR), Yin, Shubin1 (AUTHOR) yinshubinlive@gmail.com, Tang, Yong2 (AUTHOR) |
| Source: | Materials (1996-1944). Nov2025, Vol. 18 Issue 21, p5011. 16p. |
| Database: | Academic Search Ultimate |
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