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Comprehensive Structural and Interfacial Characterization of Laser-Sliced SiC Wafers.

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Title: Comprehensive Structural and Interfacial Characterization of Laser-Sliced SiC Wafers.
Authors: Chen, Hong1 (AUTHOR), Lee, Seul1,2 (AUTHOR), Kang, Minseung1,3 (AUTHOR), Youn, Hye Seon1 (AUTHOR), Go, Seongwon1,2 (AUTHOR), Kang, Eunsook2,3 (AUTHOR), Cho, Chae-Ryong1,3 (AUTHOR) crcho@pusan.ac.kr
Source: Materials (1996-1944). Dec2025, Vol. 18 Issue 24, p5615. 25p.
Database: Academic Search Ultimate
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ISSN:19961944
DOI:10.3390/ma18245615