APA (7th ed.) Citation

Chen, H., Lee, S., Kang, M., Youn, H. S., Go, S., Kang, E., & Cho, C. (2025). Comprehensive Structural and Interfacial Characterization of Laser-Sliced SiC Wafers. Materials (1996-1944), 18(24), 5615. https://doi.org/10.3390/ma18245615

Chicago Style (17th ed.) Citation

Chen, Hong, Seul Lee, Minseung Kang, Hye Seon Youn, Seongwon Go, Eunsook Kang, and Chae-Ryong Cho. "Comprehensive Structural and Interfacial Characterization of Laser-Sliced SiC Wafers." Materials (1996-1944) 18, no. 24 (2025): 5615. https://doi.org/10.3390/ma18245615.

MLA (9th ed.) Citation

Chen, Hong, et al. "Comprehensive Structural and Interfacial Characterization of Laser-Sliced SiC Wafers." Materials (1996-1944), vol. 18, no. 24, 2025, p. 5615, https://doi.org/10.3390/ma18245615.