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Comprehensive Structural and Interfacial Characterization of Laser-Sliced SiC Wafers.

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Title: Comprehensive Structural and Interfacial Characterization of Laser-Sliced SiC Wafers.
Authors: Chen, Hong1 (AUTHOR), Lee, Seul1,2 (AUTHOR), Kang, Minseung1,3 (AUTHOR), Youn, Hye Seon1 (AUTHOR), Go, Seongwon1,2 (AUTHOR), Kang, Eunsook2,3 (AUTHOR), Cho, Chae-Ryong1,3 (AUTHOR) crcho@pusan.ac.kr
Source: Materials (1996-1944). Dec2025, Vol. 18 Issue 24, p5615. 25p.
Database: Academic Search Ultimate
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DbLabel: Academic Search Ultimate
An: 190471548
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  Data: Comprehensive Structural and Interfacial Characterization of Laser-Sliced SiC Wafers.
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  Data: <searchLink fieldCode="JN" term="%22Materials+%281996-1944%29%22">Materials (1996-1944)</searchLink>. Dec2025, Vol. 18 Issue 24, p5615. 25p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=190471548
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      – Type: doi
        Value: 10.3390/ma18245615
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      – Code: eng
        Text: English
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        PageCount: 25
        StartPage: 5615
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      – TitleFull: Comprehensive Structural and Interfacial Characterization of Laser-Sliced SiC Wafers.
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            NameFull: Chen, Hong
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            NameFull: Lee, Seul
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            NameFull: Go, Seongwon
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            NameFull: Cho, Chae-Ryong
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            – D: 15
              M: 12
              Text: Dec2025
              Type: published
              Y: 2025
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