Numerical Study of the Impact of Inter-Die Thermal Conductance on the Thermal Performance of 3D ICs Cooled by a Single-Layer Microchannel Heat Exchanger.
Saved in:
| Title: | Numerical Study of the Impact of Inter-Die Thermal Conductance on the Thermal Performance of 3D ICs Cooled by a Single-Layer Microchannel Heat Exchanger. |
|---|---|
| Authors: | Zając, Piotr1 (AUTHOR) piotr.zajac@p.lodz.pl, Zabierowski, Wojciech1 (AUTHOR) |
| Source: | Energies (19961073). Dec2025, Vol. 18 Issue 23, p6150. 18p. |
| Database: | Academic Search Ultimate |
|
Full text is not displayed to guests.
Login for full access.
|
|
| ISSN: | 19961073 |
|---|---|
| DOI: | 10.3390/en18236150 |
