APA (7th ed.) Citation

Zając, P., & Zabierowski, W. (2025). Numerical Study of the Impact of Inter-Die Thermal Conductance on the Thermal Performance of 3D ICs Cooled by a Single-Layer Microchannel Heat Exchanger. Energies (19961073), 18(23), 6150. https://doi.org/10.3390/en18236150

Chicago Style (17th ed.) Citation

Zając, Piotr, and Wojciech Zabierowski. "Numerical Study of the Impact of Inter-Die Thermal Conductance on the Thermal Performance of 3D ICs Cooled by a Single-Layer Microchannel Heat Exchanger." Energies (19961073) 18, no. 23 (2025): 6150. https://doi.org/10.3390/en18236150.

MLA (9th ed.) Citation

Zając, Piotr, and Wojciech Zabierowski. "Numerical Study of the Impact of Inter-Die Thermal Conductance on the Thermal Performance of 3D ICs Cooled by a Single-Layer Microchannel Heat Exchanger." Energies (19961073), vol. 18, no. 23, 2025, p. 6150, https://doi.org/10.3390/en18236150.