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Numerical Study of the Impact of Inter-Die Thermal Conductance on the Thermal Performance of 3D ICs Cooled by a Single-Layer Microchannel Heat Exchanger.

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Title: Numerical Study of the Impact of Inter-Die Thermal Conductance on the Thermal Performance of 3D ICs Cooled by a Single-Layer Microchannel Heat Exchanger.
Authors: Zając, Piotr1 (AUTHOR) piotr.zajac@p.lodz.pl, Zabierowski, Wojciech1 (AUTHOR)
Source: Energies (19961073). Dec2025, Vol. 18 Issue 23, p6150. 18p.
Database: Academic Search Ultimate
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  Data: Numerical Study of the Impact of Inter-Die Thermal Conductance on the Thermal Performance of 3D ICs Cooled by a Single-Layer Microchannel Heat Exchanger.
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  Data: <searchLink fieldCode="AR" term="%22Zając%2C+Piotr%22">Zając, Piotr</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> piotr.zajac@p.lodz.pl</i><br /><searchLink fieldCode="AR" term="%22Zabierowski%2C+Wojciech%22">Zabierowski, Wojciech</searchLink><relatesTo>1</relatesTo> (AUTHOR)
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  Data: <searchLink fieldCode="JN" term="%22Energies+%2819961073%29%22">Energies (19961073)</searchLink>. Dec2025, Vol. 18 Issue 23, p6150. 18p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=190517877
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        Text: English
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      – TitleFull: Numerical Study of the Impact of Inter-Die Thermal Conductance on the Thermal Performance of 3D ICs Cooled by a Single-Layer Microchannel Heat Exchanger.
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              Text: Dec2025
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