View in EDS HTML Full Text PDF Full Text

Thermal Management Challenges in 2.5D and 3D Chiplet Integration: A Review on Architecture–Cooling Co-Design.

Saved in:
Bibliographic Details
Title: Thermal Management Challenges in 2.5D and 3D Chiplet Integration: A Review on Architecture–Cooling Co-Design.
Authors: Virmani, Darpan1 (AUTHOR) darpanvirmani@ufl.edu, Chatterjee, Baibhab1 (AUTHOR) chatterjee.b@ufl.edu
Source: Eng (2673-4117). Dec2025, Vol. 6 Issue 12, p373. 66p.
Database: Academic Search Ultimate
Full text is not displayed to guests.
Description
ISSN:26734117
DOI:10.3390/eng6120373