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Chemical Mechanical Polishing of Plasma‐Modified Cu/Polymer Interfaces for Advanced Hybrid Bonding.

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Title: Chemical Mechanical Polishing of Plasma‐Modified Cu/Polymer Interfaces for Advanced Hybrid Bonding.
Authors: Kang, Sukkyung1,2 (AUTHOR), Jeon, Chansu3 (AUTHOR), Park, Juseong3 (AUTHOR), Park, Seulah1 (AUTHOR), Kim, Kyung Min3 (AUTHOR) km.kim@kaist.ac.kr, Kim, Sanha1,2 (AUTHOR) sanhkim@kaist.ac.kr
Source: Advanced Science. 1/14/2026, Vol. 13 Issue 3, p1-10. 10p.
Database: Academic Search Ultimate
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ISSN:21983844
DOI:10.1002/advs.202512611