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Chemical Mechanical Polishing of Plasma‐Modified Cu/Polymer Interfaces for Advanced Hybrid Bonding.

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Title: Chemical Mechanical Polishing of Plasma‐Modified Cu/Polymer Interfaces for Advanced Hybrid Bonding.
Authors: Kang, Sukkyung1,2 (AUTHOR), Jeon, Chansu3 (AUTHOR), Park, Juseong3 (AUTHOR), Park, Seulah1 (AUTHOR), Kim, Kyung Min3 (AUTHOR) km.kim@kaist.ac.kr, Kim, Sanha1,2 (AUTHOR) sanhkim@kaist.ac.kr
Source: Advanced Science. 1/14/2026, Vol. 13 Issue 3, p1-10. 10p.
Database: Academic Search Ultimate
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DbLabel: Academic Search Ultimate
An: 190912442
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Chemical Mechanical Polishing of Plasma‐Modified Cu/Polymer Interfaces for Advanced Hybrid Bonding.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Kang%2C+Sukkyung%22">Kang, Sukkyung</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Jeon%2C+Chansu%22">Jeon, Chansu</searchLink><relatesTo>3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Park%2C+Juseong%22">Park, Juseong</searchLink><relatesTo>3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Park%2C+Seulah%22">Park, Seulah</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Kim%2C+Kyung+Min%22">Kim, Kyung Min</searchLink><relatesTo>3</relatesTo> (AUTHOR)<i> km.kim@kaist.ac.kr</i><br /><searchLink fieldCode="AR" term="%22Kim%2C+Sanha%22">Kim, Sanha</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<i> sanhkim@kaist.ac.kr</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Advanced+Science%22">Advanced Science</searchLink>. 1/14/2026, Vol. 13 Issue 3, p1-10. 10p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=190912442
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1002/advs.202512611
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 10
        StartPage: 1
    Titles:
      – TitleFull: Chemical Mechanical Polishing of Plasma‐Modified Cu/Polymer Interfaces for Advanced Hybrid Bonding.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Kang, Sukkyung
      – PersonEntity:
          Name:
            NameFull: Jeon, Chansu
      – PersonEntity:
          Name:
            NameFull: Park, Juseong
      – PersonEntity:
          Name:
            NameFull: Park, Seulah
      – PersonEntity:
          Name:
            NameFull: Kim, Kyung Min
      – PersonEntity:
          Name:
            NameFull: Kim, Sanha
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 14
              M: 01
              Text: 1/14/2026
              Type: published
              Y: 2026
          Identifiers:
            – Type: issn-print
              Value: 21983844
          Numbering:
            – Type: volume
              Value: 13
            – Type: issue
              Value: 3
          Titles:
            – TitleFull: Advanced Science
              Type: main
ResultId 1