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Numerical and Experimental Estimation of Heat Source Strengths in Multi-Chip Modules on Printed Circuit Boards.

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Bibliographic Details
Title: Numerical and Experimental Estimation of Heat Source Strengths in Multi-Chip Modules on Printed Circuit Boards.
Authors: Huang, Cheng-Hung1 (AUTHOR) chhuang@maul.ncku.edu.tw, Su, Hao-Wei1 (AUTHOR)
Source: Mathematics (2227-7390). Jan2026, Vol. 14 Issue 2, p327. 27p.
Database: Academic Search Ultimate
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ISSN:22277390
DOI:10.3390/math14020327