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Influence of Pd Coating Thickness and Pd Content in Sn-Based Solders on Interfacial IMC Formation and Microstructural Evolution in Solder/Ni Joints.

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Bibliographic Details
Title: Influence of Pd Coating Thickness and Pd Content in Sn-Based Solders on Interfacial IMC Formation and Microstructural Evolution in Solder/Ni Joints.
Authors: Wang, Chao-Hong1 (AUTHOR) chmchw@ccu.edu.tw, Li, Chu-An1 (AUTHOR), Li, Kuan-Ting1 (AUTHOR), Chiu, Hsuan-Wei1 (AUTHOR)
Source: Materials (1996-1944). Feb2026, Vol. 19 Issue 3, p526. 19p.
Database: Academic Search Ultimate
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ISSN:19961944
DOI:10.3390/ma19030526