APA (7th ed.) Citation

Wang, C., Li, C., Li, K., & Chiu, H. (2026). Influence of Pd Coating Thickness and Pd Content in Sn-Based Solders on Interfacial IMC Formation and Microstructural Evolution in Solder/Ni Joints. Materials (1996-1944), 19(3), 526. https://doi.org/10.3390/ma19030526

Chicago Style (17th ed.) Citation

Wang, Chao-Hong, Chu-An Li, Kuan-Ting Li, and Hsuan-Wei Chiu. "Influence of Pd Coating Thickness and Pd Content in Sn-Based Solders on Interfacial IMC Formation and Microstructural Evolution in Solder/Ni Joints." Materials (1996-1944) 19, no. 3 (2026): 526. https://doi.org/10.3390/ma19030526.

MLA (9th ed.) Citation

Wang, Chao-Hong, et al. "Influence of Pd Coating Thickness and Pd Content in Sn-Based Solders on Interfacial IMC Formation and Microstructural Evolution in Solder/Ni Joints." Materials (1996-1944), vol. 19, no. 3, 2026, p. 526, https://doi.org/10.3390/ma19030526.