Influence of Pd Coating Thickness and Pd Content in Sn-Based Solders on Interfacial IMC Formation and Microstructural Evolution in Solder/Ni Joints.
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| Title: | Influence of Pd Coating Thickness and Pd Content in Sn-Based Solders on Interfacial IMC Formation and Microstructural Evolution in Solder/Ni Joints. |
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| Authors: | Wang, Chao-Hong1 (AUTHOR) chmchw@ccu.edu.tw, Li, Chu-An1 (AUTHOR), Li, Kuan-Ting1 (AUTHOR), Chiu, Hsuan-Wei1 (AUTHOR) |
| Source: | Materials (1996-1944). Feb2026, Vol. 19 Issue 3, p526. 19p. |
| Database: | Academic Search Ultimate |
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| FullText | Links: – Type: pdflink Text: Availability: 1 |
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| Header | DbId: asn DbLabel: Academic Search Ultimate An: 191586753 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Influence of Pd Coating Thickness and Pd Content in Sn-Based Solders on Interfacial IMC Formation and Microstructural Evolution in Solder/Ni Joints. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Wang%2C+Chao-Hong%22">Wang, Chao-Hong</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> chmchw@ccu.edu.tw</i><br /><searchLink fieldCode="AR" term="%22Li%2C+Chu-An%22">Li, Chu-An</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Li%2C+Kuan-Ting%22">Li, Kuan-Ting</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Chiu%2C+Hsuan-Wei%22">Chiu, Hsuan-Wei</searchLink><relatesTo>1</relatesTo> (AUTHOR) – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Materials+%281996-1944%29%22">Materials (1996-1944)</searchLink>. Feb2026, Vol. 19 Issue 3, p526. 19p. |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=191586753 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.3390/ma19030526 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 19 StartPage: 526 Titles: – TitleFull: Influence of Pd Coating Thickness and Pd Content in Sn-Based Solders on Interfacial IMC Formation and Microstructural Evolution in Solder/Ni Joints. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Wang, Chao-Hong – PersonEntity: Name: NameFull: Li, Chu-An – PersonEntity: Name: NameFull: Li, Kuan-Ting – PersonEntity: Name: NameFull: Chiu, Hsuan-Wei IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 02 Text: Feb2026 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 19961944 Numbering: – Type: volume Value: 19 – Type: issue Value: 3 Titles: – TitleFull: Materials (1996-1944) Type: main |
| ResultId | 1 |