FEA study on liquid droplet stamp contact of thin film devices.
Saved in:
| Title: | FEA study on liquid droplet stamp contact of thin film devices. |
|---|---|
| Authors: | Lin, Ji1 (AUTHOR), Yu, Jie1 (AUTHOR), Zhang, Libo1 (AUTHOR), Wu, Kerong2 (AUTHOR) fyywukerong@nbu.edu.cn, Shi, Chuanqian1,3 (AUTHOR) shichuanqian@nbu.edu.cn |
| Source: | European Physical Journal: Special Topics. Feb2026, Vol. 234 Issue 24, p7551-7559. 9p. |
| Database: | Academic Search Ultimate |
| ISSN: | 19516355 |
|---|---|
| DOI: | 10.1140/epjs/s11734-025-01556-5 |
