APA (7th ed.) Citation

Lin, J., Yu, J., Zhang, L., Wu, K., & Shi, C. (2026). FEA study on liquid droplet stamp contact of thin film devices. European Physical Journal: Special Topics, 234(24), 7551. https://doi.org/10.1140/epjs/s11734-025-01556-5

Chicago Style (17th ed.) Citation

Lin, Ji, Jie Yu, Libo Zhang, Kerong Wu, and Chuanqian Shi. "FEA Study on Liquid Droplet Stamp Contact of Thin Film Devices." European Physical Journal: Special Topics 234, no. 24 (2026): 7551. https://doi.org/10.1140/epjs/s11734-025-01556-5.

MLA (9th ed.) Citation

Lin, Ji, et al. "FEA Study on Liquid Droplet Stamp Contact of Thin Film Devices." European Physical Journal: Special Topics, vol. 234, no. 24, 2026, p. 7551, https://doi.org/10.1140/epjs/s11734-025-01556-5.