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Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics.

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Bibliographic Details
Title: Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics.
Authors: Huo, Yongjun1,2 (AUTHOR), Song, Jiaqi1 (AUTHOR), Li, Wenqian1 (AUTHOR), Zhang, Jian1,2 (AUTHOR), Zhang, Yujin2 (AUTHOR), Fu, Yang1,2 (AUTHOR), Yuan, Wangchao2 (AUTHOR), Chen, Xin1 (AUTHOR), Liu, Sichen1 (AUTHOR), Jiang, Miao1,2 (AUTHOR), Cheng, Yuan3,4 (AUTHOR), Zhang, Gang1,2 (AUTHOR) gangzhang@bit.edu.cn
Source: Advanced Science. 3/23/2026, Vol. 13 Issue 17, p1-36. 36p.
Database: Academic Search Ultimate
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Description
ISSN:21983844
DOI:10.1002/advs.202524348