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Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics.

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Title: Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics.
Authors: Huo, Yongjun1,2 (AUTHOR), Song, Jiaqi1 (AUTHOR), Li, Wenqian1 (AUTHOR), Zhang, Jian1,2 (AUTHOR), Zhang, Yujin2 (AUTHOR), Fu, Yang1,2 (AUTHOR), Yuan, Wangchao2 (AUTHOR), Chen, Xin1 (AUTHOR), Liu, Sichen1 (AUTHOR), Jiang, Miao1,2 (AUTHOR), Cheng, Yuan3,4 (AUTHOR), Zhang, Gang1,2 (AUTHOR) gangzhang@bit.edu.cn
Source: Advanced Science. 3/23/2026, Vol. 13 Issue 17, p1-36. 36p.
Database: Academic Search Ultimate
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Header DbId: asn
DbLabel: Academic Search Ultimate
An: 192467627
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PubTypeId: academicJournal
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Huo%2C+Yongjun%22">Huo, Yongjun</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Song%2C+Jiaqi%22">Song, Jiaqi</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Li%2C+Wenqian%22">Li, Wenqian</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zhang%2C+Jian%22">Zhang, Jian</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zhang%2C+Yujin%22">Zhang, Yujin</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Fu%2C+Yang%22">Fu, Yang</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Yuan%2C+Wangchao%22">Yuan, Wangchao</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Chen%2C+Xin%22">Chen, Xin</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Liu%2C+Sichen%22">Liu, Sichen</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Jiang%2C+Miao%22">Jiang, Miao</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Cheng%2C+Yuan%22">Cheng, Yuan</searchLink><relatesTo>3,4</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zhang%2C+Gang%22">Zhang, Gang</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<i> gangzhang@bit.edu.cn</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Advanced+Science%22">Advanced Science</searchLink>. 3/23/2026, Vol. 13 Issue 17, p1-36. 36p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=192467627
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1002/advs.202524348
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 36
        StartPage: 1
    Titles:
      – TitleFull: Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Huo, Yongjun
      – PersonEntity:
          Name:
            NameFull: Song, Jiaqi
      – PersonEntity:
          Name:
            NameFull: Li, Wenqian
      – PersonEntity:
          Name:
            NameFull: Zhang, Jian
      – PersonEntity:
          Name:
            NameFull: Zhang, Yujin
      – PersonEntity:
          Name:
            NameFull: Fu, Yang
      – PersonEntity:
          Name:
            NameFull: Yuan, Wangchao
      – PersonEntity:
          Name:
            NameFull: Chen, Xin
      – PersonEntity:
          Name:
            NameFull: Liu, Sichen
      – PersonEntity:
          Name:
            NameFull: Jiang, Miao
      – PersonEntity:
          Name:
            NameFull: Cheng, Yuan
      – PersonEntity:
          Name:
            NameFull: Zhang, Gang
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 23
              M: 03
              Text: 3/23/2026
              Type: published
              Y: 2026
          Identifiers:
            – Type: issn-print
              Value: 21983844
          Numbering:
            – Type: volume
              Value: 13
            – Type: issue
              Value: 17
          Titles:
            – TitleFull: Advanced Science
              Type: main
ResultId 1